Supply and develop flexible conducting and non-conduction adhesive materials, solders, inks & coatings for the interconnection on fibres or between fibres, of flexible thermal management materials, protective materials for electronic devices, circuits and interconnections; benchmarking, characterization and optimization (WP1-4). Optimization of processability of materials for electronic interconnections and protection of delicate electronics (WP3). Supply and develop surface mount adhesives for integration of fibre based electronics (WP3) and give input on safety and standardization (WP6).